With the compact S1000, a micro-ATX case incorporates a tunnel for the very first time. As a result, the power supply and hard drives can install discreetly to the case bottom and out of sight. Additionally, the S1000 has a practical cable management system, which allows for orderly cabling of all components via its numerous openings and recesses, while simultaneously ensuring optimal airflow inside the case. The tunnel offers enough space for a power supply with a maximum length of 24 cm. The expanded installation space allows the mobile HDD cage, which secures via thumbscrews, to be moved up to four centimeters in the direction of the front panel, for example, for extra-long power supplies or if more space for cabling is required. Maximum length of graphics cards is up to 40 cm. Maximum height of CPU coolers is up to 15.5 cm.
Whether it is a sophisticated office computer, compact multimedia station or affordable gaming PC: The V1000 from Sharkoon offers versatile solutions for individualists. With a size of only 45 x 19.5 x 40.2 cm, the micro-ATX case is small enough to fit underneath low-rise desks. However, it still offers plenty of space for convenient extras which can only be accommodated in ATX cases. This includes a tunnel on the case bottom, which allows discreet installation of the power supply, plus cabling, as well as separate dissipation of warm air. The generous space inside the V1000 offers a wide range of possibilities for installing all the necessary components and even a radiator in the front panel.
Thanks to the provided side panels the VG4-S offers space for the hassle-free installation of tower coolers with a height of up to 16.0 cm. Graphics cards with a maximum length of up to 31.0/38.5 cm (after removing the hard drive cage) can also be mounted. A total of up to six expansion cards can be installed. The maximum length for power supplies is 25.0 cm; a suitable dust filter is pre-installed on the bottom. The VG4-S offers installation openings for a CPU cooler, two openings for optional water cooling as well as a comfortable cable management system.
Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Weight: 1.5 g
Thermal conductivity: > 4.5 W / mK
Thermal Impedance <0.205 C-in2 / W
Density: > 2.5
Evaporation: <0.001 %
Volatility: <0.005 %
The dielectric constant: > 5.1
Dissipation Factor: <0.005
Viscosity: 76 CPS
Thixotropic index: 310 ± 10 C
Operating Temperature: -50 240 C
Composites: 50% silicone compounds
Compounds: 30% of carbon
The compounds of metal oxides: 20%