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    Proizvođač: Asus

    ASUS MB H110M-R/C/SI;Intel H110;LGA1151;2xDDR4;VGA,DVI,HDMI;micro ATX

    ASUS MB H110M-R/C/SI;Intel H110;LGA1151;2xDDR4;VGA,DVI,HDMI;micro ATX


    Jedinstvena šifra artikla: 31631
    Dostupnost: Nije dostupno
    129,00 KM sa PDV-om

    MB ASUS  H110M-R/C/SI;Intel H110;LGA1151;2xDDR4;VGA,DVI,HDMI;micro ATX

    MB ASUS  H110M-R/C/SI;Intel H110;LGA1151;2xDDR4;VGA,DVI,HDMI;micro ATX

    Genelec d.o.o. Tuzla. MB ASUS H110M-R/C/SI;Intel H110;LGA1151;2xDDR4;VGA,DVI,HDMI;micro ATX
    Specifikacije proizvoda
    TIP memorije DDR4 (2133 MHz)
    Socket Intel LGA 1151
    Kupci koji su kupili ovaj artikal također su kupili

    Zidni nosač GNC PSW698SSF 17-43", 20kg, VESA 200x200, FIXED

    12,00 KM sa PDV-om
    Dostupno
    Zidni nosač GNC PSW698SSF 17-43", 20kg, VESA 200x200, FIXED

    Zidni nosač GNC PSW698SST 17-43", 20kg, VESA 200x200, NAGIB

    16,50 KM sa PDV-om
    Dostupno
    Zidni nosač GNC PSW698SST 17-43", 20kg, VESA 200x200, NAGIB

    DVD-RW LG GH24NSD1 24X BULK BLACK SATA

    31,00 KM sa PDV-om
    Nema na stanju
    DVD-RW LG GH24NSD1 24X BULK BLACK SATA

    Tastatura + miš LOGITECH MK120, black, 920-002549/920-002586/920-0190813

    41,00 KM sa PDV-om
    Dostupno
    A durable duo that brings comfort, style and simplicity together. Feel-good typing Your hands will enjoy the low-profile, whisper-quiet keys and standard layout with full-size F-keys and number pad.

    Pasta za CPU hladnjak GEMBIRD TG-G1.5-01

    6,00 KM sa PDV-om
    Dostupno
    Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive Specifications Weight: 1.5 g Color: grey Thermal conductivity: > 4.5 W / mK Thermal Impedance <0.205 C-in2 / W Density: > 2.5 Evaporation: <0.001 % Volatility: <0.005 % The dielectric constant: > 5.1 Dissipation Factor: <0.005 Viscosity: 76 CPS Thixotropic index: 310 ± 10 C Operating Temperature: -50 240 C Composites: 50% silicone compounds Compounds: 30% of carbon The compounds of metal oxides: 20%